Pioneering the Future of AI Accelerator Chip Design: The Transformative Impact of Sriganesh Chandrasekaran on Hyperscaler Technologies
Sriganesh Chandrasekaran’s journey from a small Indian town to the forefront of global semiconductor innovation is a testament to the transformative power of expertise, vision, and perseverance. His early academic pursuits at Anna University, followed by a Master’s in Electrical Engineering from the University of Texas at Dallas, laid a solid technical foundation and instilled a relentless drive for excellence. Chandrasekaran’s immersion in the U.S. semiconductor ecosystem began with an internship at Tezzaron Semiconductor, where he gained hands-on experience and direct exposure to industry leadership, setting the stage for a career defined by both technical mastery and strategic insight.
Transitioning to LSI Corporation (now Broadcom), Chandrasekaran quickly established himself as a key contributor in the ASIC Product Division. Over more than twelve years, he advanced to R&D Staff IC Design Engineer, specializing in the design and integration of AI inference and training accelerator chips for hyperscalers—companies that underpin the world’s AI and cloud infrastructure. His expertise in multi-die architectures, CoWoS technology, and advanced interposer design has enabled Broadcom to deliver solutions that redefine performance, efficiency, and scalability in AI hardware.
Chandrasekaran’s most notable technical achievement is his leadership in the development of the world’s first 3.5D XD-SiP technology. This breakthrough has delivered a sevenfold increase in signal density and a tenfold reduction in power consumption for die-to-die interfaces, all within a more compact and cost-effective package. His work has set new industry benchmarks, directly empowering large-scale AI applications and reinforcing U.S. leadership in AI and semiconductor technology. In addition to this groundbreaking work, Chandrasekaran is the inventor of a published U.S. patent application (US20250038647A1) on scalable switched capacitor voltage regulators — a power management innovation that enhances efficiency in high-performance AI chips and supports sustainable growth in data center operations. The publication of this application marks an important step in securing intellectual property protection for his invention, signaling recognition of its novelty and potential impact within the semiconductor industry.. His achievements have also earned him a place on the prestigious DesignCon 40 Under 40 list in 2024, recognizing his leadership and innovation in low-power, high-efficiency AI accelerator design and interposer technology.
Beyond technical excellence, Chandrasekaran’s work has had a profound societal impact. The AI systems powered by his designs are driving advancements in medical diagnostics, public safety, transportation, and the efficiency of critical industries. By enabling U.S. companies to scale their AI capabilities and maintain technological leadership, his contributions have reinforced the nation’s position at the forefront of global innovation. Broadcom’s rise to a $1 trillion market capitalization and its chips powering 99% of the world’s internet traffic underscore the global significance of his work.
Chandrasekaran’s ongoing commitment to research and development ensures that the United States remains a leader in AI and semiconductor innovation, with cascading benefits for education, workforce development, and national competitiveness. His career exemplifies the extraordinary impact that advanced expertise and visionary leadership can have on a field as vital as semiconductor engineering, marking him as a key architect of the technologies that will shape the future of artificial intelligence and global connectivity.
As the United States seeks to maintain its leadership in technology and innovation, professionals of his caliber will remain essential to national progress and competitiveness.
